Our History

Since its founding in 2005, Heliotis has evolved from a visionary start-up into an internationally recognized specialist in optical 3D metrology. Throughout this journey, we have brought groundbreaking technologies, such as our Lock-in pixel and high-precision white-light interferometry systems, to market maturity. Our timeline showcases the key milestones, product innovations, and partnerships that have shaped our path and enabled our customers’ success.

2025

20 Years of Heliotis AG

Two decades of innovation in optical 3D metrology – Heliotis celebrates 20 years of technology, precision, and collaborative partnerships with customers worldwide.

2024 / 2023

Award-winning Innovations

Heliotis wins the inVISION Award for outstanding image processing technology and becomes a finalist for the international Prism Award, one of the most prestigious accolades in the photonics industry.

2018 / 2020

Our Fourth Product Generation

Heliotis develops the heliSens™ S4H and an FPGA-based high-speed camera board. This forms the basis for the heliInspect™ H8 and H9 products – Heliotis’ third generation of industrial 3D sensors.

2022

Introduction of the heliSens™ S4HM

With the heliSens™ S4H, our Lock-in CMOS technology reaches a new level of performance. The S4H surpasses the one-million Lock-in pixel mark on a single chip for the first time – forming the foundation for the next generation of industrial 3D metrology.

2008

Focus on Industrial WLI

Heliotis focuses its development on industrial applications and develops 3D cameras for automation technology. The products are robust, fast, and ready for use in production.

2011 / 2014

Our Third Product Generation

Heliotis introduces the heliSens™ S3 and an FPGA-based high-speed camera board. This forms the basis for the heliInspect™ H3, H4, and H6 products in subsequent years – Heliotis’ third generation of industrial 3D sensors.

2006 /2007

First Products

Heliotis introduces the heliSens™ S2, an FPGA-based high-speed camera board. This forms the basis for the M1 and M2 3D microscopes in subsequent years.

2005

Founding of Heliotis AG

Heliotis is founded as a spin-off of CSEM, with the goal of bringing innovative optical 3D metrology from research to industry.

2000 / 2005

Research on Lock-in Pixels

Under the direction of Prof. Peter Seitz at CSEM Zurich, the first CMOS image sensors with integrated Lock-in functionality are developed. These pixels can directly detect and pre-process weakly modulated optical signals – the origin of Heliotis’ later technology.