Heliotis offers OEM partners direct access to its lock-in pixel technology, camera electronics, and firmware.
The Heliotis lock-in pixel demodulates optical signals directly within the pixel, capturing amplitude and phase synchronously with the reference signal.
Each pixel functions as a highly selective lock-in amplifier, allowing only the frequency of the reference signal to pass through, suppressing interference signals, and precisely isolating weak useful signals. This enables the sensor to achieve exceptional sensitivity, an excellent signal-to-noise ratio, and high stability, even under challenging environmental conditions.
The parallel acquisition of intensity and phase information provides valuable data for various optical measurement principles – from interferometry and spectroscopy to light modulation and fluorescence techniques.
The lock-in pixel technology forms the basis of all Heliotis sensors and provides OEM partners with access to high-precision, synchronous signal detection in a wide range of optical applications.
The heliSens™ S4 integrates millions of lock-in pixels on a single CMOS chip. With integrated ADC conversion, digital phase processing, and calibration logic, the sensor delivers precise 3D and intensity data in real time.
Its modular design and documented interface make it the ideal platform for OEM developments in optical metrology, photometry, and interferometric methods.
The heliBoard™ B4 combines the entire signal processing of the heliSens™ sensor on a compact FPGA-based camera board. The associated firmware stack handles data acquisition, synchronization, timing control, and real-time communication.
OEM partners thus receive a proven platform that can be directly integrated into their own systems via documented APIs and SDKs – from prototype to series integration.
